表面加工方法

Surface processing method

Abstract

【課題】 被加工物の被加工面の平坦化加工を高い加工速度を維持して実施する。 【解決手段】 表面加工方法は、処理水中で光触媒活性を有する薄膜を被加工物の被加工面に対向配置し、薄膜に光を照射して薄膜上で酸化力を有する活性種を生成し、活性種と被加工面の原子とを化学反応させ、被加工面を溶出可能な化合物へと変化させて除去することにより、被加工面を平坦化する。表面加工方法は、温度T(K)、大気圧下における水への酸素の溶解度をモル分率χで表すと、モル分率χと温度T(K)とは、lnχ=−66.74+{87.48/(T/100)}+24.45・ln(T/100)の関係を有し、温度T(K)における処理水中の溶存酸素量D(mg/L)がD≧3.555×10 5 χとなる条件で化学反応を行うようにした。 【選択図】図1
PROBLEM TO BE SOLVED: To perform the planarization processing of a surface to be processed of an object to be processed while maintaining a high processing speed. SOLUTION: In a surface processing method, a thin film having photocatalytic activity in treatment water is disposed so as to face the surface to be processed of the object to be processed, light is irradiated to the thin film to generate activated species having oxidizing power on the thin film, the activated species and atoms of the surface to be processed are chemically reacted to convert the surface to be processed to elutable compounds, and the elutable compounds are removed, thereby planarizing the surface to be processed. In the surface processing method, when the temperature is expressed by T (K) and solubility of oxygen to water under the atmospheric pressure is expressed as a mole fraction χ, the mole fraction χ and the temperature T (K) have a relation of lnχ=-66.74+{87.48/(T/100)}+24.45×ln(T/100), and chemical reaction is carried out under a condition where dissolved oxygen D (mg/L) in the treatment water at the temperature T (K) satisfies D≥3.555×10 5 χ. COPYRIGHT: (C)2011,JPO&INPIT

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    US-9196501-B2November 24, 2015Kabushiki Kaisha ToshibaMethod for chemical planarization and chemical planarization apparatus