表面処理装置及び表面処理方法

Apparatus for treating surface and method for treating surface

Abstract

PROBLEM TO BE SOLVED: To provide an apparatus for treating a surface in which the dispersion of an overflow height is reduced in an overflowing type apparatus for treating the surface without producing problems in increasing the dispersion even in operation over a long period of time.SOLUTION: The apparatus for treating the surface is designed to make an electrolyte flow from the lower side to the upper side in an inner tank 3 and overflow the electrolyte from an upper end 3a. In the apparatus, an electrolyte feeding passage 10 for feeding the electrolyte into the inner tank 3 is connected to the bottom wall 3b of the inner tank 3 at the upper end of the electrolyte feeding passage 10, and the upper part 10a of the electrolyte feeding passage 10 is formed into a hollow truncated pyramid state in which the cross-sectional area of an opening in the direction of the horizontal plane is gradually reduced in accordance with proceeding from the upper end toward the lower end.
【課題】 オーバーフロー式表面処理装置におけるオーバーフロー高さのバラツキを低減し、長時間の運転においてもバラツキ増大の問題を発生させない表面処理装置を提供する。 【解決手段】 内槽3内の下方から上方へ向かって電解液を流通させ、上端3aから電解液をオーバーフローさせる表面処理装置において、内槽3に電解液を供給する電解液供給路10の上端で内槽3の底壁3bに接続し、電解液供給路10の上部10aを、上端から下端に向かうに従って、水平面方向の開口部断面積が徐々に減少する中空の角錐台状に形成する。 【選択図】 図4

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