Contact image sensor

密着型イメージセンサ

Abstract

(57)【要約】 【目的】 密着型イメージセンサの光学部品の部品点数 を減らし、組立工程を簡略化する。また、原稿面から受 光素子面までの距離を短くすることにより、密着型イメ ージセンサの小型化を図る。 【構成】 密着型イメージセンサの光学系において、受 光センサチップ2を保護する透明保護板(透明保護材)4 の受光センサ側の面に、発光ダイオード(LED)アレイ (光源)1からの照明光を導く照明窓41と原稿6からの反 射光を集光し受光センサ面に結像させるマイクロフレネ ルレンズ42とを備えた密着型イメージセンサ。また、光 学系のレンズ個数を受光センサアレイの素子数に一致せ しめ、レンズ素子と受光素子とを1対1に対応させた密 着型イメージセンサ。
PURPOSE: To miniaturize a contact image sensor by reducing the number of optical parts of the contact image sensor to simplify the assembling process and shortening the distance from the document surface to the photodetector surface. CONSTITUTION: In the optical system of the contact image sensor, an illumination window 41 through which illuminating light from a light emitting diode(LED) array (light source) 1 is led and a micro Fresnel lens 42 which condenses the reflected light from a document 6 to form the image on the surface of a photodetecting sensor are provided on the face on the photodetecting sensor side of a transparent protective plate (transparent protective material) 4 which protects a photodetecting sensor chip 2. The number of lenses of the optical system is equalized to the number of elements of the photodetecting sensor array, and lens elements and photo-detectors are allowed to correspond to each other in 1:1. COPYRIGHT: (C)1994,JPO&Japio

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Cited By (13)

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    US-6169279-B1January 02, 2001Rohm Co., Ltd.Image sensor chip, method for manufacturing the same, and image sensor therefor
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