substrate (Total 225180 Patents Found)

A substrate-processing method comprising transporting a substrate to pass through a plurality of processing spaces communicated with each other while processing said substrate in each processing space, characterized in that based on an inner pressure of (a) one of said plurality of processing spaces, said inner pressur...
A liquid discharge head includes plural heat generating members, each linearly communicating with a discharge port, a liquid flow path communicating with each discharge port and having a bubble generating area in which a movable member is provided, a limiting portion opposed to the bubble generating area in the liquid ...
Apparatus and a method for printing and drying layers of ink applied to the surface of a continuous substrate in a multi-stand offset press comprising a plurality of stands, each having a printing portion for the application of a layer of ink to the substrate as it passes through the stand, and a drying assembly mounte...
It has been difficult to form a high-frequency electronic circuit using a single-crystal dielectric substrate, and down-sizing of high-frequency electronic circuits is also difficult because of necessity of a metal housing. A high-frequency electronic device comprises a single-crystal dielectric substrate provided with...
An apparatus for attenuating physical damage to a substrate, along with an attendant method, comprises as a first component a base plate having defined therein a location for receiving a substrate cassette. The apparatus also comprises a substrate retainer movably attached to the base plate such that when the substrate...
A system and method are disclosed for facilitating removal of a defect from a substrate. A charge is applied at the surface of substrate, such as in the form of an ionized gas, to weaken attractive forces between the defect and the substrate. As a result of weakening the attractive forces, a suitable defect removal sys...
A resistive element which is formed in a semiconductor substrate comprises a first semiconductor region which is formed in the semiconductor substrate and in which an impurity is diffused at a first concentration; a second semiconductor region which is connected to the first semiconductor region at one end and in which...
A plasma processing method comprises the steps of supplying a low-frequency bias to a first electrode carrying a substrate, and supplying a high-frequency power to a second electrode facing the first electrode, wherein the low-frequency bias is supplied to the first electrode in advance of starting plasma by the energy...
A thermosetting polymer powder coating composition comprising finely divided powder particles that have a diameter of about 1-100 microns wherein the powder particles are a blend of A. an acrylic polymer; B. a blocked organic polyisocyanate; C. a hydroxy functional plasticizer; and D. a catalyti...
A surface acoustic wave filter includes a Y-cut X-propagation LiTaO 3 substrate having a cut angle of about 38 degrees to about 46 degrees, at least first and second series arm surface acoustic wave resonators connected in series to define a series arm, and at least one parallel arm surface acoustic wave resonator con...
A loader station of substrate treating apparatus receives a transport cassette from a preceding stage. This transport cassette stores a plurality of substrates to be treated, arranged with a predetermined spacing therein. An empty processing cassette stands by at the loader station when the transport cassette arrives. ...
Vertical epitaxial SOI transistors and memory cells are disclosed. The devices are formed completely within a substrate trench and have a bulk channel epitaxially grown on an exposed surface of the substrate within the trench. The bulk channel is disposed proximate to a transistor gate electrode such that an inversion ...
The present invention discloses compositions as well as methods of making and using said compositions, having improved stability which, when applied to a variety of substrates and cured, form transparent coatings having abrasion resistant properties and a matched refractive index to that of the substrate. The compositi...
The method for the manufacture of multilayer connecting substrates with multiple functions comprises the design of the connecting substrate taking place in functionally separated manner, in that signal conducting substrate parts ( 19 ), power supplying substrate parts ( 2 ), mechanical substrate parts ( 7 ), as well as...
In a semiconductor photoelectric conversion device in which a first light-transparent conductive layer for an electrode is formed on a light transparent substrate, a non-single-crystal semiconductor laminate member having formed therein at least one PIN or PN junction is formed on the first conductive layer and a secon...
The circuit element has a first layer composed of an electrically insulating substrate material and a first electrically conductive material which is in the form of at least one discrete area such that it is embedded in the substrate material and/or is applied to the substrate material. Furthermore, it has a second lay...
An electro-optical device substrate has substrate devices, each composed of at least a portion of an electro-optical device having an image display region, on a surface thereof, and is divided into the substrate devices along boundaries between regions where the substrate devices are formed. The electro-optical device ...
The present invention relates to a method for producing an epitaxial substrate having a III-V group compound semiconductor crystal represented by the general formula In x Ga y Al z N (wherein, x+y+z=1, 0≦x≦1, 0≦y≦1, 0≦z≦1) having reduced dislocation density, comprising a first step of covering with a mask m...
The invention relates to a manufacturing method of a semi-conductor on insulator substrate from an SOI substrate comprising a surface layer of silicon on an electrically insulating layer, called buried insulating layer, wherein a layer of Si 1-x Ge x is formed on the superficial layer of silicon. The method comp...
The present invention relates to a procedure for applying relief inscriptions in plastic material to a substrate, characterised in that it comprises a step in which a plastic material of variable viscosity is deposited in real time in a single operation, only at those places that form the relief inscription, at a suffi...
A method for forming a gate stack which minimizes or eliminates damage to the gate dielectric layer and/or silicon substrate during the gate stack formation by the reduction of the temperature during formation. The temperature reduction prevents the formation of silicon clusters within the metallic silicide film in the...
This invention provides a multilayer printed wiring board which achieves fine pitches. A heat resistant substrate is incorporated in a multilayer printed wiring board and interlayer resin insulation layer and conductive layer are placed alternately on the heat resistant substrate. A built-up wiring board in which respe...
A method and apparatus for providing a substrate coating having a predetermined resistivity is described. The method comprises the steps of providing a substrate to be coated in a vacuum chamber, creating a plasma in the chamber, and depositing ions of the plasma on the substrate to form a ta-C substrate coating. The c...
A thin film transistor substrate of horizontal electric field type includes: a gate line and a first common line formed on a substrate to be in parallel to each other; a data line crossing the gate line and the first common line with a gate insulating film therebetween to define a pixel area; a second common line cross...
An apparatus for aligning microelements on a substrate and a method for the same are provided. The steps of the method include providing a substrate, forming a protruding structure on the substrate, providing a microelement, forming a microdroplet on the protruding structure, and forcing the microelement to contact the...
A substrate processing apparatus includes a processing vessel; a mounting table for mounting the substrate thereon in the processing vessel; a gas inlet unit provided in the processing vessel; a gas supply mechanism for supplying a hydrogen-containing gas into the processing vessel through the gas inlet unit; a gas dis...
An integrated circuit device and method. A substrate having contacts has a plurality of capacitors thereon. A plurality of fusible links selectively connect the plurality of capacitors to one another and selected ones of the capacitors to the contacts. In this manner, for example, the capacitance value can be adjusted ...